Zalman Thermal Compound OEM, 1,5g

Branded hot pasta designed to improve heat transfer between heat source and condenser.It is intended for normal use for processors, graphics cards, chipsets, memory, and more.Improves the contact of the two components and thus helps to reduce the temperature and extend the life of expensive integrated circuits.Pasta is also completely non-conductive, so there is no risk of accidental spillage during short circuit components.

Properties
Thermal conductivity1.2 W/m.Toward
Operating temperature:-50 To 170 ° C
Storage temperature:below 10 ° C
Quantity:1.5 grams

Note:be applied in a very thin layer, and the only place of direct contact with the cooler chip.