Endorphs Pactum 1 4g

Endorfy Pactum 1 thermal paste improves heat transfer between components such as the processor and its cooler, helping to maintain optimum operating temperatures and boost system stability. The paste features a thermal conductivity of 4W/mK and a density of 2.5g/cm³. The package includes 4g of paste and a practical spatula for easy, even application across the component surface.