Cooler Master 400 ThermalFusion

First-class thermal compound under cooler with high thermal conductivity, low thermal resistance and no electrical conductivity. It is intended for all performance components that require maximum cooling such as video cards, processors, memory and chipset. The package will also find umělohmoutnou spatula to evenly spread the paste to the desired surface. Obah paste in a tube is 4 grams.
Specifications:
Weight: 4 g
Color:
Gray
Thermal conductivity:
2.89 W/mK
Temperature stability:
-40 ~ 150 ° C
Evaporation (120 ° C x 24 h):
<0.1%

Durability:
24 months after opening